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PCB design guide to via and trace currents and temperatures /Douglas Brooks with Johannes Adam.

By: Contributor(s): Material type: TextTextDescription: 1 online resourceContent type:
  • text
Media type:
  • computer
Carrier type:
  • online resource
ISBN:
  • 9781630818616
Subject(s): Genre/Form: LOC classification:
  • TK7868 .P333 2021
Online resources: Available additional physical forms:
Contents:
Introduction and Historical Background -- Materials Used in PCBs -- Resistivity and Resistance -- Trace Heating and Cooling -- IPC Curves -- Thermal Simulations -- Thermal Simulations -- Via Temperatures -- Current Densities in Vias -- Thinking Outside the Boxes -- Fusing Currents: Background -- Fusing Currents: Analyses -- Do Traces Heat Uniformly? -- Stop Thinking about Current Density -- AC Currents -- Industrial CT (X-Ray) Scanning -- Measuring Thermal Conductivity -- Measuring Resistivity -- IPC Internal and Vacuum Curves Fitted wi -- Current/Temperature Curves, 0.25 to 5.0 -- Current Density in Vias -- Derivation of Onderdonk's Equation -- Results of All Six Fusing Configuration -- Nonuniform Heating Patterns.
Subject: A very important part of printed circuit board (PCB) design involves sizing traces and vias to carry the required current. This exciting new book will explore how hot traces and vias should be and what board, circuit, design, and environmental parameters are the most important. PCB materials (copper and dielectrics) and the role they play in the heating and cooling of traces are covered. The IPC curves found in IPC 2152, the equations that fit those curves and computer simulations that fit those curves and equations are detailed. Sensitivity analyses that show what happens when environments are varied, including adjacent traces and planes, changing trace lengths, and thermal gradients are presented. Via temperatures and what determines them are explored, along with fusing issues and what happens when traces are overloaded. Voltage drops across traces and vias, the thermal effects going around right-angle corners, and frequency effects are covered. Readers learn how to measure the thermal conductivity of dielectrics and how to measure the resistivity of copper traces and why many prior attempts to do so have been doomed to failure. Industrial CT Scanning, and whether or not they might replace microsections for measuring trace parameters are also considered.
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Item type Current library Collection Call number URL Status Date due Barcode
Online Book (LOGIN USING YOUR MY CIU LOGIN AND PASSWORD) Online Book (LOGIN USING YOUR MY CIU LOGIN AND PASSWORD) G. Allen Fleece Library ONLINE Non-fiction TK7868.7 (Browse shelf(Opens below)) Link to resource Available on1245493806

Includes bibliographies and index.

Introduction and Historical Background -- Materials Used in PCBs -- Resistivity and Resistance -- Trace Heating and Cooling -- IPC Curves -- Thermal Simulations -- Thermal Simulations -- Via Temperatures -- Current Densities in Vias -- Thinking Outside the Boxes -- Fusing Currents: Background -- Fusing Currents: Analyses -- Do Traces Heat Uniformly? -- Stop Thinking about Current Density -- AC Currents -- Industrial CT (X-Ray) Scanning -- Measuring Thermal Conductivity -- Measuring Resistivity -- IPC Internal and Vacuum Curves Fitted wi -- Current/Temperature Curves, 0.25 to 5.0 -- Current Density in Vias -- Derivation of Onderdonk's Equation -- Results of All Six Fusing Configuration -- Nonuniform Heating Patterns.

A very important part of printed circuit board (PCB) design involves sizing traces and vias to carry the required current. This exciting new book will explore how hot traces and vias should be and what board, circuit, design, and environmental parameters are the most important. PCB materials (copper and dielectrics) and the role they play in the heating and cooling of traces are covered. The IPC curves found in IPC 2152, the equations that fit those curves and computer simulations that fit those curves and equations are detailed. Sensitivity analyses that show what happens when environments are varied, including adjacent traces and planes, changing trace lengths, and thermal gradients are presented. Via temperatures and what determines them are explored, along with fusing issues and what happens when traces are overloaded. Voltage drops across traces and vias, the thermal effects going around right-angle corners, and frequency effects are covered. Readers learn how to measure the thermal conductivity of dielectrics and how to measure the resistivity of copper traces and why many prior attempts to do so have been doomed to failure. Industrial CT Scanning, and whether or not they might replace microsections for measuring trace parameters are also considered.

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