MARC details
| 000 -LEADER |
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| fixed length control field |
03284cam a2200349Ii 4500 |
| 001 - CONTROL NUMBER |
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| control field |
on1245493806 |
| 003 - CONTROL NUMBER IDENTIFIER |
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| control field |
OCoLC |
| 005 - DATE AND TIME OF LATEST TRANSACTION |
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| control field |
20240726104839.0 |
| 008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION |
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| fixed length control field |
210408s2021 mau o 000 0 eng d |
| 040 ## - CATALOGING SOURCE |
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| Original cataloging agency |
IEEEE |
| Language of cataloging |
eng |
| Description conventions |
rda |
| -- |
pn |
| Transcribing agency |
IEEEE |
| Modifying agency |
OCLCO |
| -- |
OCLCF |
| -- |
Z5A |
| -- |
UKAHL |
| -- |
NT |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER |
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| International Standard Book Number |
9781630818616 |
| Qualifying information |
|
| 050 04 - LIBRARY OF CONGRESS CALL NUMBER |
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| Classification number |
TK7868 |
| Item number |
.P333 2021 |
| 049 ## - LOCAL HOLDINGS (OCLC) |
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| Holding library |
MAIN |
| 100 1# - MAIN ENTRY--PERSONAL NAME |
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| Personal name |
Brooks, Douglas, |
| Dates associated with a name |
1940- |
| Relator term |
Author |
| 245 10 - TITLE STATEMENT |
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| Title |
PCB design guide to via and trace currents and temperatures /Douglas Brooks with Johannes Adam. |
| 300 ## - PHYSICAL DESCRIPTION |
|---|
| Extent |
1 online resource |
| 336 ## - CONTENT TYPE |
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| Content type term |
text |
| Content type code |
txt |
| Source |
rdacontent |
| 337 ## - MEDIA TYPE |
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| Media type term |
computer |
| Media type code |
c |
| Source |
rdamedia |
| 338 ## - CARRIER TYPE |
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| Carrier type term |
online resource |
| Carrier type code |
cr |
| Source |
rdacarrier |
| 347 ## - DIGITAL FILE CHARACTERISTICS |
|---|
| File type |
data file |
| Source |
rda |
| 504 ## - BIBLIOGRAPHY, ETC. NOTE |
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| Bibliography, etc. note |
Includes bibliographies and index. |
| 505 00 - FORMATTED CONTENTS NOTE |
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| Title |
Introduction and Historical Background -- |
| -- |
Materials Used in PCBs -- |
| -- |
Resistivity and Resistance -- |
| -- |
Trace Heating and Cooling -- |
| -- |
IPC Curves -- |
| -- |
Thermal Simulations -- |
| -- |
Thermal Simulations -- |
| -- |
Via Temperatures -- |
| -- |
Current Densities in Vias -- |
| -- |
Thinking Outside the Boxes -- |
| -- |
Fusing Currents: Background -- |
| -- |
Fusing Currents: Analyses -- |
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Do Traces Heat Uniformly? -- |
| -- |
Stop Thinking about Current Density -- |
| -- |
AC Currents -- |
| -- |
Industrial CT (X-Ray) Scanning -- |
| -- |
Measuring Thermal Conductivity -- |
| -- |
Measuring Resistivity -- |
| -- |
IPC Internal and Vacuum Curves Fitted wi -- |
| -- |
Current/Temperature Curves, 0.25 to 5.0 -- |
| -- |
Current Density in Vias -- |
| -- |
Derivation of Onderdonk's Equation -- |
| -- |
Results of All Six Fusing Configuration -- |
| -- |
Nonuniform Heating Patterns. |
| 520 0# - SUMMARY, ETC. |
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| Summary, etc. |
A very important part of printed circuit board (PCB) design involves sizing traces and vias to carry the required current. This exciting new book will explore how hot traces and vias should be and what board, circuit, design, and environmental parameters are the most important. PCB materials (copper and dielectrics) and the role they play in the heating and cooling of traces are covered. The IPC curves found in IPC 2152, the equations that fit those curves and computer simulations that fit those curves and equations are detailed. Sensitivity analyses that show what happens when environments are varied, including adjacent traces and planes, changing trace lengths, and thermal gradients are presented. Via temperatures and what determines them are explored, along with fusing issues and what happens when traces are overloaded. Voltage drops across traces and vias, the thermal effects going around right-angle corners, and frequency effects are covered. Readers learn how to measure the thermal conductivity of dielectrics and how to measure the resistivity of copper traces and why many prior attempts to do so have been doomed to failure. Industrial CT Scanning, and whether or not they might replace microsections for measuring trace parameters are also considered. |
| 530 ## - COPYRIGHT INFORMATION: |
|---|
| COPYRIGHT INFORMATION |
COPYRIGHT NOT covered - Click this link to request copyright permission: |
| Uniform Resource Identifier |
<a href="b">b</a> |
| 650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM |
|---|
| Topical term or geographic name entry element |
Printed circuits |
| General subdivision |
Design and construction. |
| 655 #1 - INDEX TERM--GENRE/FORM |
|---|
| Genre/form data or focus term |
Electronic Books. |
| 700 1# - ADDED ENTRY--PERSONAL NAME |
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| Personal name |
Adam, Johannes, |
| Relator term |
|
| 856 40 - ELECTRONIC LOCATION AND ACCESS |
|---|
| -- |
Click to access digital title | log in using your CIU ID number and my.ciu.edu password. |
| Uniform Resource Identifier |
<a href="httpss://search.ebscohost.com/login.aspx?direct=true&scope=site&db=nlebk&db=nlabk&AN=2945408&site=eds-live&custid=s3260518">httpss://search.ebscohost.com/login.aspx?direct=true&scope=site&db=nlebk&db=nlabk&AN=2945408&site=eds-live&custid=s3260518</a> |
| 942 ## - ADDED ENTRY ELEMENTS (KOHA) |
|---|
| Koha item type |
Online Book (LOGIN USING YOUR MY CIU LOGIN AND PASSWORD) |
| DONATED BY: |
|
| VENDOR |
EBSCO |
| Classification part |
TK. |
| PUBLICATION YEAR |
2021 |
| LOCATION |
ONLINE |
| REQUESTED BY: |
|
| -- |
|
| -- |
NFIC |
| Source of classification or shelving scheme |
|
| 994 ## - |
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| -- |
92 |
| -- |
NT |
| 902 ## - LOCAL DATA ELEMENT B, LDB (RLIN) |
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| a |
1 |
| b |
Cynthia Snell |
| c |
1 |
| d |
Cynthia Snell |