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Indium phosphide HBT in thermally optimized periphery for applications up to 300 GHz.

By: Material type: TextTextSeries: Publication details: Göttingen : Cuvillier Verlag, (c)2016.Description: 1 online resource (155 pages)Content type:
  • text
Media type:
  • computer
Carrier type:
  • online resource
ISBN:
  • 3736982879
  • 9783736982871
Subject(s): Genre/Form: LOC classification:
  • TK7871 .I535 2016
Online resources: Available additional physical forms:
Contents:
sink InP HBT MMICs; 6 Summary; 7 Outlook; Publications; Appendix; Bibliography.
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Acknowledgment; Zusammenfassung; Abstract; Contents; 1 Introduction; 2 Diamond substrate properties; 3 Thermal resistance of HBTs; 4 Electrical and thermal via connection through the diamond layer; 5 Full process integration and realization of diamond heat -- sink InP HBT MMICs; 6 Summary; 7 Outlook; Publications; Appendix; Bibliography.

Includes bibliographical references.

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