000			03284cam a2200349Ii 4500
001			on1245493806
003			OCoLC
005			20240726104839.0
008			210408s2021 mau o 000 0 eng d
040			_aIEEEE _beng _erda _epn _cIEEEE _dOCLCO _dOCLCF _dZ5A _dUKAHL _dNT
020			_a9781630818616 _q((electronic)l(electronic)ctronic)
050	0	4	_aTK7868 _b.P333 2021
049			_aMAIN
100	1		_aBrooks, Douglas, _d1940- _e1
245	1	0	_aPCB design guide to via and trace currents and temperatures /Douglas Brooks with Johannes Adam.
300			_a1 online resource
336			_atext _btxt _2rdacontent
337			_acomputer _bc _2rdamedia
338			_aonline resource _bcr _2rdacarrier
347			_adata file _2rda
504			_a2
505	0	0	_tIntroduction and Historical Background -- _tMaterials Used in PCBs -- _tResistivity and Resistance -- _tTrace Heating and Cooling -- _tIPC Curves -- _tThermal Simulations -- _tThermal Simulations -- _tVia Temperatures -- _tCurrent Densities in Vias -- _tThinking Outside the Boxes -- _tFusing Currents: Background -- _tFusing Currents: Analyses -- _tDo Traces Heat Uniformly? -- _tStop Thinking about Current Density -- _tAC Currents -- _tIndustrial CT (X-Ray) Scanning -- _tMeasuring Thermal Conductivity -- _tMeasuring Resistivity -- _tIPC Internal and Vacuum Curves Fitted wi -- _tCurrent/Temperature Curves, 0.25 to 5.0 -- _tCurrent Density in Vias -- _tDerivation of Onderdonk's Equation -- _tResults of All Six Fusing Configuration -- _tNonuniform Heating Patterns.
520	0		_aA very important part of printed circuit board (PCB) design involves sizing traces and vias to carry the required current. This exciting new book will explore how hot traces and vias should be and what board, circuit, design, and environmental parameters are the most important. PCB materials (copper and dielectrics) and the role they play in the heating and cooling of traces are covered. The IPC curves found in IPC 2152, the equations that fit those curves and computer simulations that fit those curves and equations are detailed. Sensitivity analyses that show what happens when environments are varied, including adjacent traces and planes, changing trace lengths, and thermal gradients are presented. Via temperatures and what determines them are explored, along with fusing issues and what happens when traces are overloaded. Voltage drops across traces and vias, the thermal effects going around right-angle corners, and frequency effects are covered. Readers learn how to measure the thermal conductivity of dielectrics and how to measure the resistivity of copper traces and why many prior attempts to do so have been doomed to failure. Industrial CT Scanning, and whether or not they might replace microsections for measuring trace parameters are also considered.
530			_a2 _ub
650		0	_aPrinted circuits _xDesign and construction.
655		1	_aElectronic Books.
700	1		_aAdam, Johannes, _e1
856	4	0	_zClick to access digital title | log in using your CIU ID number and my.ciu.edu password. _uhttpss://search.ebscohost.com/login.aspx?direct=true&scope=site&db=nlebk&db=nlabk&AN=2945408&site=eds-live&custid=s3260518
942			_cOB _D _eEB _hTK. _m2021 _QOL _R _x _8NFIC _2LOC
994			_a92 _bNT
999			_c80321 _d80321
902			_a1 _bCynthia Snell _c1 _dCynthia Snell